A solder bar is a solid form of solder, it’s a mixture of metals such as tin, lead, and sometimes silver or other metals. The most common martial composition is 60% tin and 40% lead (Sn60Pb40), which can melts at a lower temperature and having excellent wetting properties. These bars are used in different soldering applications to join electronic components to PCBs boards. Solder bars are cylindrical in shape and melted to form solder joints between electronic components with the help of wave soldering process using through-hole soldering techniques.
DARNAS Adhesive and Sealants Pvt. Ltd is one of the largest soldering solution manufacture in India. we are working on the industry very well and understating electronics components requirement and making soldering products that can fulfill industry requirement.
DARNAS Adhesive and Sealants Pvt Ltd. stands as a reputated name in the Indian soldering industry, renowned for wide range of soldering materials and solutions. With a strong top-notch quality and customer satisfaction, DARNAS has established itself as a trusted supplier and manufacture of solder bars diverse needs of electronics manufacturers in the country.
both traditional leaded and environmentally friendly lead-free solder bars, providing customers with a choice that aligns with customers specific preferences and needs.
Solder bars are predominantly used in wave soldering, a process critical for through-hole technology (THT) in PCB assembly. Here’s how solder bars are utilized in this context:
Melting the Solder Bar: In wave soldering, the solder bar is melted in a crucible or wave soldering machine. The temperature is carefully controlled to ensure the solder reaches its liquid state without overheating or oxidizing.
Creating the Solder Wave: Once bars are melted, the solder is formed into a wave by a pump. This wave of molten solder moves steadily across the width of the PCB board, covering the pads and leads of the through-hole components.
Soldering Process: after that the PCB moves through the wave, the solder makes contact with the exposed metal pads and leads of the through-hole components. The surface of the molten solder adheres to these metal surfaces, forming a strong, reliable electrical connection.
Cooling and Solidification: After passing through the wave, the solder joints begin to cool and solidify, securing the components firmly in place.
Through-Hole Soldering: In this process, electronic components with leads are inserted into drilled holes on the PCB. The molten solder from the wave soldering process fills these holes, securing the components in place and ensuring electrical connectivity.
The composition of solder bars is critical as it determines the melting temperature, mechanical properties, and environmental considerations of the solder joints. here we find some best composition of solder bars and the characteristics.
Sn63Pb37: This alloy consists of 63% tin and 37% lead by weight sharp melting point (183°C). This composition provides excellent wetting properties and is widely used in electronics assembly.
Sn60Pb40: Comprising 60% tin and 40% lead, this alloy has a slightly lower melting point than Sn63Pb37 (183-190°C). It is favored for its lower melting temperature, which can help prevent thermal damage to sensitive components during soldering.
Sn99Cu1 (Tin-Copper): Comprising 99% tin and 1% copper, this alloy has a higher melting point (around 227°C) compared to leaded solders. offers good mechanical strength and is widely used in electronics manufacturing.
Sn95.5Ag3.8Cu0.7 (Tin-Silver-Copper): This alloy contains 95.5% tin, 3.8% silver, and 0.7% copper. It has excellent soldering properties and is commonly used in industries requiring high-reliability solder joints.
Efficiency: Solder bars allow for continuous replenishment of solder in the wave soldering machine, enabling long production runs without interruption.
Consistency: The controlled composition of solder bars ensures consistent quality of solder joints.
Cost-Effectiveness: Using solder bars in bulk can be more economical for large-scale manufacturing compared to other forms of solder.
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